Xiamen Pinhe Precision Technology Co., Ltd
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High Efficiency Super Thin Cable Saw for Stone Cutting
Product Introduction
Product Parameters
| Block Entry into Machine | From side (as picture shown above) |
| Trolley Movement | Trolley (block) going up |
| Dimension | 6M(L) * 4M(W) * 6.5M(H) |
| Motors | Siemens Servo Motor Control System Main Motor 60kw |
| Total Power | 300kw |
| Processing Size | L3400mm * W2000m * H2200mm |
| Cutting Wire Speed | 0-35m/min |
| Cutting Down Feed | 0-25cm/h |
| Roller Material | Aviation Aluminum Roller ф350mm |
| Wire Storage | 30-50km |
| G.W | 45 Tons |
| Bearing Housing | German NSK Bearing with High Speed Housing |
| Wire Diameter | 0.38mm - 0.8mm |
| Main Body | Cast Iron |
| PLC | AI Automatic Control System of Siemens |
**1. Origin and Development of Diamond Wire Saw Technology**
Diamond wire saw technology originated from the multi-wire cutting machines used in the photovoltaic industry for silicon wafer processing. Its core process involves electroplating a layer of diamond particles onto a thin metal wire, utilizing the grinding action of the diamonds to achieve material cutting. Since its adoption in the photovoltaic silicon wafer processing industry in 2015, the technology has undergone two critical developmental phases:
- **2015–2017**: Replaced traditional mortar wire cutting processes, with cumulative installations exceeding **10,000 units** in the photovoltaic sector.
- **2017–2020**: Expanded into the rare-earth magnetic materials industry, achieving installations surpassing **10,000 units**.
After nearly a decade of industrial application (as of 2024), diamond wire saw technology has matured and established a complete industrial chain. Beyond dominating the photovoltaic and magnetic materials sectors, it has also replaced traditional processes in hard and brittle material processing industries such as sapphire, optical glass, and graphite.
**2. China’s Unique Market Position and Technological Expansion**
China’s photovoltaic and magnetic materials industries hold over **95% of the global market share**, creating a uniquely favorable environment for the development of diamond wire saw technology. As the technology matured, supporting multi-wire cutting equipment, diamond wires, and auxiliary industrial chains achieved scaled development, driving continuous cost reductions.
**3. Challenges in Technological Breakthroughs for Stone Processing**
In 2018, Pinhe began exploring the application of diamond wire saws in the stone industry, encountering the following technical challenges:
- **Dimensional Disparity**: Stone processing sizes (based on **800 × 210 × 210 mm**) are **over 10 times larger** than materials like photovoltaic silicon wafers.
- **Process Complexity**: Requires addressing the material heterogeneity and dimensional variability of stone.
- **Cost Optimization**: Involves systemic improvements in cutting efficiency, consumable costs, and equipment stability.
Currently, while diamond wire saws are fully mature in the photovoltaic sector, their application in stone processing remains in the industrialization breakthrough phase, necessitating solutions for ultra-large-scale cutting process adaptation.